Micross finished-BGA reballing and alloy conversion

Micross Components · Engineering measurement and characterization

Purpose: Assess finished-BGA reballing or alloy conversion while distinguishing original ball geometry and thermal history from reworked results.
Technical approach: Existing balls and alloy residue are removed, pads refinished and balls replaced. Micross offers tin-lead and RoHS-compliance conversion services.
Scope of use: Confirm the specific ceramic or plastic BGA, pitch, diameter, alloy and package condition with the provider.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Reballing changes alloy and thermal history; improved coplanarity or fatigue life is not automatic. Published pitch does not qualify every device or establish microbump capability.
What to prepare
BLNKK suggests preparing part/ball-layout details, existing and target alloys, diameters and reflow/rework history. Height and electrical baselines can support before/after comparisons.
Confirm with the supplier
Confirm compatibility, removal/refinishing/attachment thermal steps and pad controls. Agree on post-rework height, coplanarity, electrical and relevant reliability checks and acceptance criteria.
Public evidence: Micross lists the process and pitches from 0.40 mm; it supplies no post-rework coplanarity or fatigue result for your device on this page.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.