Shin-Etsu MicroSi SIPR 7120 bump plating resist

Shin-Etsu MicroSi · Material properties and interface engineering

Purpose: Compare plating-mold thickness/openings when investigating bump-height variation.
Technical approach: SIPR 7120 positive chemically amplified i-line thick resists form temporary molds for solder-bump/copper-pillar plating.
Scope of use: Evaluate compatible plating processes with confirmed grade, coating/exposure/development and stripping conditions.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Resist does not measure or guarantee plated-height uniformity. Series examples do not qualify every grade or wafer process.
What to prepare
BLNKK suggests preparing target heights/openings, film thickness, lithography, plating/strip conditions and profile/height/residue comparisons.
Confirm with the supplier
Confirm grade, equipment/bath compatibility, process windows and representative-wafer profile/strip validation.
Public evidence: The named page and undated Revision 2.3 datasheet document series identity and use.

Supporting references

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