Shin-Etsu MicroSi

Explore the supplier’s public information and its documented technical solutions.

Public capability summary

Semiconductor packaging materials · thermal interface materials

Material properties and interface design

Applications: Thermal interfaces and gaps · Bump plating-mask/formation comparison · RDL dielectric thermomechanical comparison

Catalog solutions · 3

Material properties and interface engineering

X-23-8098-A/B thermal gap filler

Gaps between heat-transfer components where contact, curing and assembly conditions affect thermal resistance.

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Material properties and interface engineering

Shin-Etsu MicroSi SIPR 7120 bump plating resist

Compare plating-mold thickness/openings when investigating bump-height variation.

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Material properties and interface engineering

Shin-Etsu MicroSi SINR photoimageable dielectric

Compare permanent RDL dielectric/interface conditions when assessing thermal-cycling open risks.

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Candidates in engineering problem guides

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Public sources

Contact information

Contact the supplier directly through its official channels.

This is the Shin-Etsu MicroSi US contact. Select Packaging or Thermal Interface Material in the form and provide your country to confirm the responsible team. Official source ↗

United States · Supplier office

Shin-Etsu MicroSi, Inc. — Phoenix Office

Phone: +1 480 8938898

Official source ↗Source checked 2026-10-06

Contacts are listed in the supplier’s public information. Confirm product responsibility and service coverage with the supplier.

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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.