SELFA UV-release temporary bonding tape
SEKISUI Chemical · Material properties and interface engineering
- Purpose
- Thin-wafer processing needs stable temporary support followed by controlled release loads and residue, rather than selecting material on initial adhesion alone.
- Technical approach
- The documented SELFA glass-carrier process uses PreUV curing, then UV-triggered nitrogen generation at the tape/glass interface to assist separation.
- Scope of use
- SEKISUI lists double-sided HW for back-grinding through dicing and different single-sided HS/MP uses. Selection depends on carrier, contacting materials and thermal history.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsSeries differ in construction, use and heat conditions; one thermal rating cannot cover every grade. The reviewed sources do not establish the selected grade’s UV window; near 300 °C is an interview research target, while easy-release claims are not universal zero-damage/residue guarantees.
What to prepareBLNKK suggests preparing the tape, wafer and carrier stack, thicknesses and surfaces, thermal history, UV light path and current removal method. Establish trial baselines for release force, residue and cracking.
Confirm with the supplierConfirm series/grade, lamination conditions and the wavelength/dose/order of PreUV and gas-generation exposures, plus carrier/equipment compatibility. Agree release, cleaning and wafer-integrity validation.
- Public evidence
- The product page describes the two-stage UV/gas-release mechanism and separates the families; the development interview supplies temporary-fixation context.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.