SELFA UV-release temporary bonding tape
Thin-wafer processing needs stable temporary support followed by controlled release loads and residue, rather than selecting material on initial adhesion alone.
SEKISUI Chemical
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- Temporary bonding · adhesives · thermal and semiconductor process materials
Applications: Thin-wafer support and debonding · Electronic heat-source / cooling-structure gaps · Die-attach bondline/material comparison
Catalog solutions · 3
TIMLIGHT silicone thermal gap pads
Thermal gaps need pad-thickness, compression and aged-contact comparisons to assess interface resistance.
SEKISUI Micropearl bondline spacer particles
Die-attach void comparisons also need controlled bondline spacing and particle distribution.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- SELFA UV-release temporary bonding tape · Edge chipping and cracking after ultrathin-wafer grinding, handling or debonding →
- SEKISUI Micropearl bondline spacer particles · Initial die-attach voids and incomplete coverage →
- TIMLIGHT silicone thermal gap pads · TIM displacement and pump-out during aging →
Public sources
Contact information
Contact the supplier directly through its official channels.
Specify the material name, such as SELFA or Micropearl. For TIMLIGHT thermal interface materials, use SEKISUI Polymatech’s product inquiry entry. Overseas phones are company or group routing contacts. Official source ↗
United States · Supplier office
SEKISUI Products, LLC — San Jose / Group Materials Inquiry
- Phone
- +1 408 642 5680
Official source ↗Source checked
Taiwan · Supplier office
SEKISUI Chemical (Taiwan) Co., Ltd. — Materials Inquiry
- Phone
- +886 2 2523 5335
Official source ↗Source checked
Mainland China · Supplier office
SEKISUI Polymatech (Shanghai) Co., Ltd. — Thermal Materials
- Phone
- +86 21 6442 2002
Official source ↗Source checked
More regional contacts (1)
Japan · Headquarters
SEKISUI Polymatech Co., Ltd. — Saitama Headquarters / General Routing
- Phone
- +81 48 611 6601
Official source ↗Source checked
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