SEKISUI Micropearl bondline spacer particles

SEKISUI Chemical · Material properties and interface engineering

Purpose: Die-attach void comparisons also need controlled bondline spacing and particle distribution.
Technical approach: Plastic Micropearl spheres act as paste spacers to help control semiconductor-to-substrate thickness.
Scope of use: Official applications include semiconductor pastes; match grade, size and compression response to adhesive and gap.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Spacing does not guarantee void-free attachment. Test narrow-gap interference and effects on flow, electrical and thermal behavior.
What to prepare
BLNKK suggests adhesive, gap, size distribution/loading and bonding pressure alongside dispersion, thickness, void and adhesion results.
Confirm with the supplier
Confirm grade, size/hardness, surface treatment and compatibility with representative attachment specimens.
Public evidence: The current page names plastic semiconductor spacers and distinguishes metal-plated microspheres.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.