MWS-SiCXα SiC multi-wire saw

Takatori Corporation · Process equipment and thermal control

Purpose: SiC ingot slicing where wafer thickness variation and surface damage need to be evaluated after cutting.
Technical approach: Combines multi-wire cutting with rigid body/spindles, stable control, work rocking and steady slurry delivery.
Scope of use: Upstream SiC substrate slicing, with workpiece, wire and feed settings confirmed for the model and material.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Equipment specifications do not guarantee wafer thickness uniformity or damage depth; they do not establish package-dicing capability.
What to prepare
BLNKK suggests preparing ingot dimensions and material condition, target thickness, wire and slurry conditions, and acceptance methods for thickness variation and damage.
Confirm with the supplier
Confirm compatible workpieces, wire and feed settings, slurry controls and consumables. Arrange slicing trials followed by thickness, warpage and damage measurements.
Public evidence: Takatori’s bilingual sheet dated March 18, 2026 identifies the SiC model, mechanisms and equipment specifications.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.