MWS-SiCXα SiC multi-wire saw
SiC ingot slicing where wafer thickness variation and surface damage need to be evaluated after cutting.
Takatori Corporation
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- Wafer slicing · grinding · bonding and material processing equipment
Applications: SiC ingot slicing · Post-grind 300 mm thin wafers
Catalog solutions · 2
ATM-12000DR vacuum mounting and thin-wafer transfer
Compare thin-wafer support transitions during mounting and protective-tape removal.
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Public sources
Contact information
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Taiwan, China, US and UK contacts are manufacturer-listed semiconductor-equipment agents. The Japan phone provides headquarters routing. MWS slicing equipment has separate agency assignments; specify the equipment and process. Official source ↗
United States · Supplier-listed distributor · Sales inquiries
GTI Technologies, Inc. — Takatori Semiconductor Equipment Agent
- Phone
- +1 203 929 2200
Official source ↗Source checked
Taiwan · Supplier-listed distributor · Sales inquiries
Toyo Adtec Co., Ltd. — Takatori Semiconductor Equipment Agent
- Phone
- +886 2 8245 4588
Official source ↗Source checked
Mainland China · Supplier-listed distributor · Sales inquiries
TOYO ADTEC Co., Ltd. — Shanghai Branch / Takatori Semiconductor Equipment Agent
- Phone
- +86 21 5236 1680
Official source ↗Source checked
More regional contacts (2)
Japan · Headquarters
Takatori Corporation — Nara Headquarters / General Routing
- Phone
- +81 744 24 8580
Official source ↗Source checked
United Kingdom · Supplier-listed distributor · Sales inquiries
JTA Equipment Technology — Takatori Semiconductor Equipment Agent
- Phone
- +44 7906 388 508
Official source ↗Source checked
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