FP3000W framed-wafer prober

Tokyo Seimitsu (ACCRETECH) · Warpage, topography and stress metrology

Purpose: Establishes probing contact on frame-retained wafers/devices to assess coordinate and fixture effects on test results.
Technical approach: Combines frame handling and position correction with probing and test-head integration for electrical testing.
Scope of use: 300 mm framed wafers and frame-mounted CSP/WLP devices. Confirm options for PLP, wafer dual transfer and high-temperature testing.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Correction does not diagnose buried opens. Probe card, test head and programs must be integrated; PLP/high-temperature capabilities are not default configurations.
What to prepare
BLNKK suggests preparing frame and die maps, dimensions and thickness, contact and probe-card information, test-head details, temperature conditions and contact-failure records.
Confirm with the supplier
Confirm frame/PLP formats, transfer/temperature options, coordinate calibration, needle-mark inspection and tester/probe-card compatibility.
Public evidence: ACCRETECH separately lists frame applications and options, including diced 300 mm-square and up-to-330 mm-square PLP testing.

Contact the supplier

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