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Tokyo Seimitsu (ACCRETECH)

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Public capability summary

  • Wafer probing · precision measurement · dicing and grinding process control
Measurement, inspection and failure localizationProcess equipment and window control

Applications: Framed wafers / WLP / PLP · Thin-wafer backside · Wafer edge / notch · Fan-out / BGA / QFN substrates

Catalog solutions · 4

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Contact information

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Use this form for semiconductor manufacturing equipment, contract processing or used equipment. The current official semiconductor support directory lists the Taiwan, Shanghai and US office phones. Precision metrology has a separate contact route; choose the one for your product. Official source ↗

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