AD3000TW fan-out substrate blade dicing

Tokyo Seimitsu (ACCRETECH) · Process equipment and thermal control

Purpose: Fan-out substrate singulation needs support, clamping and kerf comparisons that separate handling deformation from cutting damage.
Technical approach: AD3000TW uses opposing twin blade spindles with dedicated frames and square jig tables.
Scope of use: ACCRETECH lists up to 315 × 315 mm square work and fan-out WLP, BGA, QFN and ceramic substrates.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Size/material coverage does not qualify arbitrary warpage or stacks, nor guarantee no chipping. Validate actual workpiece shape and cutting damage.
What to prepare
BLNKK suggests preparing dimensions/warpage, stack/thickness, streets, frame/clamping, blade/feed/water conditions and kerf records.
Confirm with the supplier
Confirm fixture compatibility, blade/spindle options, allowable warpage/process conditions and kerf, chipping and handling acceptance methods.
Public evidence: The product body documents package-substrate design, frame handling and work dimensions.

Contact the supplier

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