W-GM-5200 wafer-edge shaping

Tokyo Seimitsu (ACCRETECH) · Process equipment and thermal control

Purpose: Thinning-related edge-chipping review needs wafer-edge/notch geometry and before/after damage comparisons.
Technical approach: W-GM-5200 combines edge grinding/mirror finishing with contactless thickness, diameter and notch-depth checks.
Scope of use: Wafers up to 300 mm and named material examples are documented; confirm ultrathin-wafer, film and carrier compatibility.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Diameter/material coverage does not establish arbitrary thin-wafer compatibility or zero chipping. Validate added damage and handling strength.
What to prepare
BLNKK suggests preparing material/thickness, edge/notch profiles, cracks, films, support and before/after geometry/damage records.
Confirm with the supplier
Confirm processable thickness/support, grinding/finishing conditions, measurement definitions and edge exclusion; discuss downstream handling/thinning validation.
Public evidence: ACCRETECH describes model-specific edge processing and multi-point geometry measurement.

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