PG3000RMII thin-wafer grinding and wet polish

Tokyo Seimitsu (ACCRETECH) · Process equipment and thermal control

Purpose: Thin-wafer review needs stage-by-stage grinding damage, polishing removal and handling comparisons to locate breakage risks.
Technical approach: PG3000RMII integrates grinding/wet polishing with thinning-specific transport, dicing-tape application and protective-tape peeling.
Scope of use: Backside processing needs supplier-confirmed materials, dimensions, target thickness and support/tape configuration.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Descriptions do not guarantee damage-free or breakage-free specimens. Metrology, TTV correction and linked processes depend on configuration.
What to prepare
BLNKK suggests preparing stack/support, stage thickness/TTV, damage depth/roughness, polishing conditions and stage-specific breakage records.
Confirm with the supplier
Confirm consumables, transport/tape compatibility, options and measurement methods; discuss residual damage, strength and downstream pickup validation.
Public evidence: The brochure describes grinding-to-polishing stress removal and separately lists NCIG, Auto-TTV and other options.

Contact the supplier

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