TMAP optical metrology platform

Unity Semiconductor · Warpage, topography and stress metrology

Purpose: Identify the thickness and feature measurements needed for advanced packaging before selecting a TMAP module configuration.
Technical approach: UnitySC describes multiple non-contact modules with automated handling, naming TSV, TTV and CD measurements. Specific sensors require configuration documentation.
Scope of use: EMD lists advanced packaging, 3DIC, interposer and HBM applications. Verify substrate formats, support and stack compatibility separately.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Configurability does not establish every panel format or buried-defect inspection capability. Readable current sources do not establish a specific panel-warpage measurement range.
What to prepare
BLNKK suggests preparing target features/thicknesses, stacks, formats and handling. For panel topography, add expected warp, sampling areas and reference measurements.
Confirm with the supplier
Request the current model/module datasheet. Confirm principles, formats, ranges and calibration, then assess repeatability, correlation and exports using representative samples.
Public evidence: The current EMD listing establishes the brand; an official UnitySC post names modules and measurements. Full model and module specifications remain unverified.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.