TMAP optical metrology platform
Identify the thickness and feature measurements needed for advanced packaging before selecting a TMAP module configuration.
Unity Semiconductor
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- 3D inspection and metrology for wafer-level and advanced packaging
Applications: 3D IC, interposers and HBM · Unpatterned carrier surfaces · Visible RDL patterns/reference samples
Catalog solutions · 3
LightSpeed unpatterned carrier-defect comparison
Carrier cleaning needs before/after or reference-sample comparisons of exposed surface defects.
Wotan visible-pattern dual-sided AOI review
RDL short investigation needs visible patterns correlated with process stages and electrical locations.
Candidates in engineering problem guides
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Public sources
Contact information
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Unity’s former website now redirects to Merck / EMD metrology and inspection. In the current Electronics form, select Metrology and Inspection and specify the product and your location. Official source ↗
Supplier updates and ownership →
BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.