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Wotan visible-pattern dual-sided AOI review

Unity Semiconductor · Engineering measurement and characterization

Purpose
RDL short investigation needs visible patterns correlated with process stages and electrical locations.
Technical approach
Full-color optics and simultaneous dual-sided AOI inspect visible surface patterns.
Scope of use
Consider visible-pattern or post-lithography review, with feature size, contrast and sampling confirmed.
Limitations and open questions

These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.

Scope and limitations

An apparent bridge does not prove an electrical short; surface images do not reveal buried lines. The page gives no resolution qualification for the actual RDL.

What to prepare

BLNKK suggests preparing line/space, surface details, process images and electrical locations, with comparable normal/abnormal samples.

Confirm with the supplier

Confirm optical configuration, visibility, classification and feature recognition, plus image-to-electrical correlation.

Public evidence
The official Wotan entry documents these capabilities under UNITY-SC.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.

Related engineering problems

These links use established solution relationships. Continue to engineering conditions and evaluation preparation.

BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.