Wotan visible-pattern dual-sided AOI review
Unity Semiconductor · Engineering measurement and characterization
- Purpose
- RDL short investigation needs visible patterns correlated with process stages and electrical locations.
- Technical approach
- Full-color optics and simultaneous dual-sided AOI inspect visible surface patterns.
- Scope of use
- Consider visible-pattern or post-lithography review, with feature size, contrast and sampling confirmed.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsAn apparent bridge does not prove an electrical short; surface images do not reveal buried lines. The page gives no resolution qualification for the actual RDL.
What to prepareBLNKK suggests preparing line/space, surface details, process images and electrical locations, with comparable normal/abnormal samples.
Confirm with the supplierConfirm optical configuration, visibility, classification and feature recognition, plus image-to-electrical correlation.
- Public evidence
- The official Wotan entry documents these capabilities under UNITY-SC.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
These links use established solution relationships. Continue to engineering conditions and evaluation preparation.
BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.
