CR-8000 Design Force package co-design

Zuken · Package architecture and warpage compensation

Purpose: Coordinate die, package and PCB connectivity and routing for multi-die and signal/power assessment.
Technical approach: Hierarchical 3D design coordinates placement, bumps and routing across dies, interposers, packages and PCBs. Extraction/analysis depend on modules and interfaces.
Scope of use: Single/multi-die, wire-bond, flip-chip and 2.5D/3D co-design. Confirm project structures, process rules and models.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Geometry/connectivity preparation does not complete interposer crosstalk analysis. Confirm extraction, frequencies and ports; board PI/EMI or partner integration does not validate every package.
What to prepare
BLNKK suggests die/bump connectivity, stacks, materials, routing/return paths and frequency/signal/power models. Define comparison cases and exchange formats.
Confirm with the supplier
Confirm version, package rules, optional modules/licenses, solver interfaces and model-exchange scope. Validate data and results with a representative interposer case.
Public evidence: Official pages document hierarchy and bump/RDL routing. ScenarioEX, Design Force SI and PI/EMI Analysis Module are explicitly optional.

Supporting references

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