CR-8000 Design Force package co-design
Coordinate die, package and PCB connectivity and routing for multi-die and signal/power assessment.
SOLUTION NAVIGATORExplore the supplier’s public information and its documented technical solutions.
View contact information ↓Applications: Chiplets, packages and PCBs
Coordinate die, package and PCB connectivity and routing for multi-die and signal/power assessment.
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
Contact the supplier directly through its official channels.
For package and electronics design software, select Products/Solutions in the Traditional Chinese form and specify the product and design requirements. The official directory provides other regional contacts; the US Sales number is a US toll-free number. Official source ↗
United States · Supplier office · Sales inquiries
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Taiwan · Supplier office
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Mainland China · Supplier office
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United States · Headquarters
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Japan · Headquarters
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Contacts are listed in the supplier’s public information. Confirm product responsibility and service coverage with the supplier.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.