ALSI LASER1206 multi-beam laser dicing and grooving

ASMPT SEMI Solutions · Process equipment and thermal control

Purpose: Compare laser-dicing/grooving quality and heat impact on representative stacks using integrated LASER1206 processing and wafer handling.
Technical approach: Multi-beam UV/Matrix-DOE processing integrates coating, cleaning and drying. UV dicing and ultrashort-pulse grooving are distinct process choices.
Scope of use: For advanced-packaging and power-device wafers; UV-Dicing Plus and UV-USP-Grooving list different materials, thicknesses and applications.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Do not combine dicing/grooving ranges. Planar positioning accuracy is not kerf accuracy, and other materials/models do not establish your stack’s damage or yield.
What to prepare
BLNKK suggests preparing stacks, thickness, streets/metal layout, support and coatings; correlate kerf, heat-affected zones, sidewalls, strength and electrical results on matched samples.
Confirm with the supplier
Confirm wavelength, pulses, beams, scans, thickness applicability and coating/cleaning. Obtain stack-specific trial cuts and agree on dimensional/damage measurement and acceptance.
Public evidence: The named product page and September 2025 launch identify LASER1206 capabilities. Low-heat-impact claims do not prove zero damage on your samples.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.