FIREBIRD die-level thermo-compression bonding
Fine-pitch heterogeneous integration requires controlled die alignment, force and heat to evaluate interconnect and die/substrate bonding conditions.
ASMPT SEMI Solutions
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Thermo-compression bonding · hybrid bonding · advanced packaging assembly
Other names: ASMPT
Applications: HPC, AI, HBM and heterogeneous integration · Wafer dicing / grooving · Opto-photonic eutectic die attach · Small leadframe epoxy die attach
Catalog solutions · 4
ALSI LASER1206 multi-beam laser dicing and grooving
Compare laser-dicing/grooving quality and heat impact on representative stacks using integrated LASER1206 processing and wafer handling.
AD211Plus-II heated-collet eutectic die attach
Initial eutectic-attach void comparisons need metallurgy, heating and atmosphere histories.
AD832i small-package epoxy die attach
Initial epoxy-attach void assessment needs dispensing and die-placement comparisons.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- AOR TCB active oxide-removal approach · Non-wetting, cold joints and opens in HBM thermocompression bonding →
- FIREBIRD die-level thermo-compression bonding · Non-wetting, cold joints and opens in HBM thermocompression bonding →
- AD211Plus-II heated-collet eutectic die attach · Initial die-attach voids and incomplete coverage →
- AD832i small-package epoxy die attach · Initial die-attach voids and incomplete coverage →
- ALSI LASER1206 multi-beam laser dicing and grooving · Heat-affected damage from laser singulation →
- ALSI LASER1206 multi-beam laser dicing and grooving · Heat-affected damage from laser singulation →
Public sources
- Product information: FIREBIRD die-level thermo-compression bonding
- Public reference: site/assets/files/84853/asmpt_esg_report_2025_en.pdf
- Technical reference: Advanced-packaging solutions and FIREBIRD thermo-compression bonding (PDF)
- Product information: ALSI LASER1206 multi-beam laser dicing and grooving
- Product information: AD211Plus-II heated-collet eutectic die attach
- Product information: AD832i small-package epoxy die attach
Contact information
Contact the supplier directly through its official channels.
Taiwan · Supplier office
ASMPT Technology Limited Taiwan Branch — Hsinchu
- Phone
- +886 3 573 3750
Official source ↗Source checked
Germany · Supplier office · Sales inquiries
ASMPT GmbH & Co. KG — Munich
- sales.eu@asmpt.com
- Phone
- +49 89 20800 20900
Official source ↗Source checked
Contacts are listed in the supplier’s public information. Confirm product responsibility and service coverage with the supplier.
Supplier updates and ownership →
BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.