AD832i small-package epoxy die attach

ASMPT SEMI Solutions · Process equipment and thermal control

Purpose: Initial epoxy-attach void assessment needs dispensing and die-placement comparisons.
Technical approach: AD832i combines dual dispensing and a bond head with high-density leadframe handling and SPC/IQC functions.
Scope of use: The named scope includes small QFN, SOIC and SOP packages; match adhesive, die and leadframe to the project.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Dispense control does not ensure void-free attach; SPC/IQC does not directly establish bond-layer integrity. Read evidence does not specify project adhesive cure or void results.
What to prepare
BLNKK suggests documenting rheology, dispense pattern/volume, bond-line thickness, placement force and cure conditions, with void and bond-strength comparisons.
Confirm with the supplier
Confirm die/leadframe compatibility, dispense/placement windows, adhesive compatibility, curing arrangements and available process-monitoring data.
Public evidence: The official page documents small-dot/dual dispensing, bond-head and process-control features.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.