Asterion wedge bonding and process monitoring
Kulicke & Soffa · Process equipment and thermal control
- Purpose
- Power-wire bond lift and heel fatigue need bonding settings, wire/loop geometry and initial quality to be compared together.
- Technical approach
- Asterion combines position control and pattern recognition for wedge bonding. K&S lists captured-image review, BPM+ monitoring of each bond and in-situ non-destructive pulltest.
- Scope of use
- A power-wire-bonding candidate; supported wire materials and diameters, pad finishes, tools and fixtures depend on the actual configuration.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsMonitoring or a single non-destructive pull check does not establish heel-fatigue life. Asterion PW/TW are different products; their specifications cannot be transferred. Confirm which monitoring functions are installed.
What to prepareBLNKK suggests preparing wire/loop, pad and tool information, with bonding logs, initial pull/fracture modes and local thermal loading. Plan post-cycle cross-section and fracture comparisons.
Confirm with the supplierConfirm BPM/BPM+, pulltest version, settings, sampling frequency, thresholds and data export. Compare monitoring alerts with measured bond quality on representative samples.
- Public evidence
- The named Asterion page documents these functions. The Chinese page calls BPM an option; installed version and configuration need confirmation.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.