APAMA PLUS chip-to-substrate and chip-to-wafer thermo-compression bonding
C2S/C2W assembly needs controlled bonding processes and monitoring of production drift, assessed with actual dies and materials.
Kulicke & Soffa
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View contact information ↓Public capability summary
- Thermo-compression · flip chip · wire bonding and advanced packaging
Applications: PoP and chip-to-substrate/chip-to-wafer bonding · Power semiconductors / wire bonding · Wafer gold-stud bumps · Discrete-power copper-clip packages · Gold / copper ball-wire packages
Catalog solutions · 5
Asterion wedge bonding and process monitoring
Power-wire bond lift and heel fatigue need bonding settings, wire/loop geometry and initial quality to be compared together.
ATPremier gold-stud bump formation
Compare gold-stud formation and shape control for height distribution and subsequent bonding.
AVALINE copper-clip assembly line
Clip-attach voiding or shift comparisons need controlled solder supply, placement and reflow.
RAPID Pro thermosonic ball-wire bonding
Compare Au/Cu ball-wire bonds and loops for bond-strength, lift and fatigue assessment.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- TCB temperature, pressure, and tilt-control evaluation · Non-wetting, cold joints and opens in HBM thermocompression bonding →
- APAMA PLUS chip-to-substrate and chip-to-wafer thermo-compression bonding · Non-wetting, cold joints and opens in HBM thermocompression bonding →
- ATPremier gold-stud bump formation · Microbump height variation and coplanarity →
- Asterion wedge bonding and process monitoring · Power wire-bond lift-off and heel fatigue →
- Asterion wedge bonding and process monitoring · Power wire-bond lift-off and heel fatigue →
- RAPID Pro thermosonic ball-wire bonding · Power wire-bond lift-off and heel fatigue →
- AVALINE copper-clip assembly line · Copper-clip attachment integrity in power devices →
Public sources
- Product information: APAMA PLUS chip-to-substrate and chip-to-wafer thermo-compression bonding
- Public reference: 2015-09-01-Kulicke-Soffa-Introduces-the-APAMA-C2W-Chip-to-Wafer-Thermo-Compression-Bonder
- Product information: Asterion wedge bonding and process monitoring
- Product information: ATPremier gold-stud bump formation
- Product information: AVALINE copper-clip assembly line
- Product information: RAPID Pro thermosonic ball-wire bonding
Contact information
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Use the General inquiries form for new-product, solution or general inquiries. The custserv mailbox is designated for customer support and order inquiries, rather than general new-solution sales. Official source ↗
United States · Supplier office · Sales inquiries
Kulicke and Soffa Industries, Inc. — Fort Washington Sales and Service
- Phone
- +1 215 784 6000
Official source ↗Source checked
Taiwan · Supplier office · Sales inquiries
Kulicke & Soffa Asiapac, Inc. — Hsinchu Sales and Service
- Phone
- +886 3 552 5600
Official source ↗Source checked
Mainland China · Supplier office · Sales inquiries
Kulicke & Soffa (Shanghai) International Trading Co., Ltd. — Sales and Service
- Phone
- +86 21 5080 5400
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More regional contacts (2)
Singapore · Headquarters · Sales inquiries
Kulicke & Soffa Pte. Ltd. — Corporate Headquarters, Sales and Service
- Phone
- +65 6880 9600
Official source ↗Source checked
Company contact · General contact · Technical support
Kulicke & Soffa — Customer Support and Order Inquiries
- custserv@kns.com
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