APAMA PLUS chip-to-substrate and chip-to-wafer thermo-compression bonding

Kulicke & Soffa · Process equipment and thermal control

Purpose: C2S/C2W assembly needs controlled bonding processes and monitoring of production drift, assessed with actual dies and materials.
Technical approach: A fully automated modular TCB platform supports TC-NCF, TC-NCP and TC-CUF with process monitoring.
Scope of use: K&S identifies PoP and chip-to-substrate or chip-to-wafer bonding. Confirm compatibility with the particular package, underfill and equipment configuration.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Process qualification does not qualify every customer package. Public evidence provides no universal warpage tolerance, void-reduction or throughput guarantee.
What to prepare
BLNKK suggests preparing die and substrate dimensions, thickness and warpage, bumps, underfill, bonding flow, yield criteria and throughput targets.
Confirm with the supplier
Confirm the configuration, material route, temperature and force windows, process monitors, and accuracy, cycle time and yield measured on representative samples.
Public evidence: K&S reports qualification of the three processes at major OSATs. The page does not quantify customer-package warpage improvement or production throughput.

Contact the supplier

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