RAPID Pro thermosonic ball-wire bonding
Kulicke & Soffa · Process equipment and thermal control
- Purpose
- Compare Au/Cu ball-wire bonds and loops for bond-strength, lift and fatigue assessment.
- Technical approach
- Thermosonic ball bonding, looping and second bonds use ProSuite response-based bonding/looping support.
- Scope of use
- Evaluate compatible Au/Cu ball-wire packages with confirmed pads, wire and RAPID Pro configuration.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsCommercial use does not prove lift-free joints or fatigue life. Wedge-bond recipes do not transfer automatically.
What to prepareBLNKK suggests preparing wire/pads, capillaries, loops, temperature/force/ultrasound conditions and pull/shear/fatigue comparisons.
Confirm with the supplierConfirm configuration, bonding/looping windows, failure-mode assessment and representative-sample reliability validation.
- Public evidence
- The technology page explains ball bonding; the May 2024 announcement names RAPID Pro and ProSuite.
Supporting references
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.