AVALINE copper-clip assembly line
Kulicke & Soffa · Process equipment and thermal control
- Purpose
- Clip-attach voiding or shift comparisons need controlled solder supply, placement and reflow.
- Technical approach
- AVALINE integrates D dual dispensing, C theta/force-monitored clip placement and V low-oxygen vacuum reflow.
- Scope of use
- For discrete-power copper-clip packages; confirm die, leadframe, clip and solder configuration.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsPublished void figures lack target-package/test conditions and are not project guarantees. Vacuum reflow does not qualify every finish, solder or joint gap.
What to prepareBLNKK suggests recording die/clip dimensions, finish, flatness, solder volume, gap and profiles, with void, shift and strength comparisons.
Confirm with the supplierConfirm modules/carriers, dispensing and placement controls, vacuum/atmosphere profiles, and inspection, sampling and acceptance methods.
- Public evidence
- The official page describes D/C/V roles and applications including DrMOS and MOSFET devices.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.