Datacon 8800 CHAMEO ultra plus AC hybrid bonding
Besi · Process equipment and thermal control
- Purpose
- Assess clean die handling, alignment and placement for hybrid bonding in high-density 3D integration. Surface preparation and final bond quality must be evaluated alongside placement accuracy.
- Technical approach
- Optical alignment and precision placement work with a clean working area, thin-die handling and inline IR inspection. Automation and preprocessing integration can be configured around the upstream surface-preparation flow.
- Scope of use
- For hybrid-bond process development and production integration in high-density interconnects and 3D systems. Published handling supports 12-inch target wafers and specified die dimensions/thicknesses; confirm materials, tooling and configuration for the application.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsAlignment specifications and dry-cycle throughput do not guarantee production yield or end-to-end capacity. Verify surface condition, particles, warpage, alignment marks and upstream processes with the proposed equipment configuration.
What to prepareBLNKK suggests preparing wafer/die dimensions and thicknesses, pad layouts, surface/warpage measurements, marks and preprocessing details. Define quality, capacity and cleanliness targets before sample trials.
Confirm with the supplierAsk Besi about compatible handling, die ejection, tooling and preprocessing integration. Use supplier sample builds to agree on tests for alignment, bond quality, contamination and actual cycle time.
- Public evidence
- Besi lists an ISO3 working area, 100 nm alignment at 3 sigma/worst-corner GOG, and up to 2,000 CPH in dry cycle. Customer-material demonstrations are offered; those specifications do not establish full-process throughput or bond yield.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.