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Public capability summary

  • Thermo-compression bonding · hybrid bonding · die attach
Process equipment and window controlPackage structures and deformation compensationReliability validation and failure analysis

Applications: Die-to-wafer hybrid bonding and 3D IC · Molded BGA / QFN · Epoxy die attach · Power-package soft-solder attachment

Catalog solutions · 4

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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.