Esec 2100 SSI soft-solder die attach

Besi · Process equipment and thermal control

Purpose: Evaluate dispensing, heating and force conditions for initial solder die attach in power packages.
Technical approach: Combines die placement, a Soft Solder Indexer, dispensing/prepress and programmable heating and atmosphere control.
Scope of use: Primarily documented for leadframe soft-solder packages; high-force diffusion soldering or direct sintering requires suitable options and materials.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Machine functions do not guarantee void-free joints. High-force and direct-sintering applications are configuration-dependent.
What to prepare
BLNKK suggests preparing die/leadframe geometry, metallization, solder, dose and thermal profiles, plus void, bondline and strength results.
Confirm with the supplier
Confirm options, tooling and process windows; arrange trials with actual materials and agree on joint-quality acceptance.
Public evidence: The product page and two-page datasheet describe functions and identify high-force options.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.