Esec 2100 hSi volume-controlled epoxy die attach

Besi · Process equipment and thermal control

Purpose: Compare adhesive volume and die placement for initial voids, tilt and bondline thickness.
Technical approach: Dual dispensing/volume control pairs with placement correction and selected height/vision controls.
Scope of use: Evaluate epoxy die attach with compatible dies, substrates, adhesives and required inspection/handling options.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Volume/placement control does not ensure zero voids; family features/options are not installed on every hSi.
What to prepare
BLNKK suggests preparing rheology, dispense patterns/volume, dies/substrates, target bondline, placement/cure conditions and void comparisons.
Confirm with the supplier
Confirm configuration/windows, height/volume inspection and void/tilt/bond-strength validation.
Public evidence: The named page and i-family brochure describe dispense/placement controls and configurable inspection capabilities.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.