Simcenter Micred T3STER transient thermal characterization
Siemens Digital Industries Software · Warpage, topography and stress metrology
- Purpose
- Rising thermal resistance after cycling calls for repeatable heat-path comparisons to investigate where changes may occur.
- Technical approach
- T3STER uses electrical temperature sensing to measure heating/cooling transients, deriving thermal impedance and structure functions for comparison and model calibration.
- Scope of use
- Power devices and multi-die packages with accessible, calibratable electrical temperature sensing. Separate die observations depend on connections and heat paths.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsStandalone T3STER measurement is not an integrated power cycler. Structure functions alone cannot establish a specific delamination or individual HBM-layer temperatures in complex parallel heat paths.
What to prepareBLNKK suggests documenting sensing connections, temperature calibration, heating power and switching, cooling boundaries and cycle history, with matched before/after conditions.
Confirm with the supplierConfirm electrical sensing feasibility, measurement configuration, sampling and calibration, and multi-die interpretation. Discuss integrated cycling separately if needed.
- Public evidence
- Siemens’ 2018 primer describes interface comparisons and calibration. Its 2019 IGBT case shows how sensing terminals and power accounting affect thermal-resistance interpretation.
Supporting references
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Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.