Simcenter 3D coupled thermal-structural simulation
Analyze thermal deformation and stress to compare package, module or electronic-system structures, materials and cooling designs.
Siemens Digital Industries Software
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Electronics cooling · package thermal characterization · thermo-mechanical workflows
Applications: Packages, modules and electronic systems · IGBT / MOSFET / SiC power devices and modules · 3D ICs, chiplets, stacked die and heterogeneous integration · Power devices / multi-die packages · Package shields and return structures
Catalog solutions · 5
Simcenter Micred Power Tester for power cycling and failure-in-progress monitoring
Repeated heating and cooling can degrade a power device’s thermal path or electrical behavior. Power Tester tracks these changes during cycling to support package and assembly comparisons.
Calibre 3DStress multiscale stress and warpage analysis for 3D ICs
Evaluates assembly- and temperature-induced stress, die warpage and device sensitivity in 3D ICs, supporting TSV-adjacent design decisions.
Simcenter Micred T3STER transient thermal characterization
Rising thermal resistance after cycling calls for repeatable heat-path comparisons to investigate where changes may occur.
Simcenter Feko shielding and electromagnetic coupling comparison
Package shielding/coupling assessment needs actual shields, returns and excitation models.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- Simcenter 3D coupled thermal-structural simulation · Warpage reversal during cooling in large 2.5D FCBGA packages →
- Simcenter Micred T3STER transient thermal characterization · Rising thermal resistance during power cycling →
- Simcenter Micred Power Tester for power cycling and failure-in-progress monitoring · Rising thermal resistance during power cycling →
- Simcenter Micred T3STER transient thermal characterization · Thermal coupling and layer temperatures in HBM stacks →
- Calibre 3DStress multiscale stress and warpage analysis for 3D ICs · Stress around TSVs and device keep-out design →
- Simcenter Feko shielding and electromagnetic coupling comparison · Package electromagnetic coupling and shielding window →
Public sources
- Product information: Simcenter 3D coupled thermal-structural simulation
- Public reference: media/global/zh/simcenter-3d-solution-guide-ebook_tcm60-96838.pdf
- Technical reference: Simcenter 3D for thermal multiphysics simulation (PDF)
- Product information: Simcenter Micred Power Tester for power cycling and failure-in-progress monitoring
- Public reference: hr-HR/e-book-using-simcenter-to-test-the-thermal-performance-of-electronics/
- Product information: Calibre 3DStress multiscale stress and warpage analysis for 3D ICs
- Public reference: en-US/technical-paper-calibre-3dstress-advanced-stress-analysis-for-reliable-3d-ic-design/
- Product information: Simcenter Micred T3STER transient thermal characterization
- Product information: Simcenter Feko shielding and electromagnetic coupling comparison
Contact information
Contact the supplier directly through its official channels.
For Simcenter and thermomechanical simulation, select Sales inquiries and the simulation/PLM software category, then name the product. The listed number is Siemens Software’s US routing line. Official source ↗
United States · Supplier office
Siemens Software — Engineering / PLM / Chip Design / Semiconductor
- Phone
- +1 512 2873494
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