Simcenter 3D coupled thermal-structural simulation

Siemens Digital Industries Software · Thermo-mechanical simulation and lifetime prediction

Purpose: Analyze thermal deformation and stress to compare package, module or electronic-system structures, materials and cooling designs.
Technical approach: Builds thermal and structural models in a shared environment. Load transfer, coupling, contact, creep and multistep nonlinear analyses depend on solvers and licenses.
Scope of use: For thermo-mechanical design studies; packaging reflow or cycling cases require defined materials, histories and boundary conditions.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Software capability is not a validated package model. Constitutive data, stress-free temperature, assembly sequence and mesh need measurement-based checking.
What to prepare
Prepare geometry, stack-ups, temperature-dependent materials, thermal history and constraints, plus suitable temperature, warpage or stress-related measurements.
Confirm with the supplier
Confirm modules/licenses, material models, coupling and import support, and calibration, convergence and validation methods.
Public evidence: Official Siemens thermal and structural guides document transient heat transfer, coupling and nonlinear analysis, including add-on module dependencies. These capabilities do not establish validated predictions for a particular package.

Supporting references

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