Lumerical–OpticStudio fiber-to-chip coupling workflow

Ansys, part of Synopsys · Thermo-mechanical simulation and lifetime prediction

Purpose: Compare fiber-to-chip coupling loss against optical modes, microlens geometry and alignment errors.
Technical approach: MODE, OpticStudio POP, FDTD and MODE/EME handle fiber modes, lens propagation, the chip interface and spot-size conversion, respectively. Fiber-mode solving is optional for suitable sources.
Scope of use: For fiber–microlens–PIC edge-coupler assemblies; other fibers, lenses or waveguides require updated models and field transfers.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
The example omits silicon-substrate scattering and does not use tip/tilt in its baseline. Thermal drift needs external temperature/displacement inputs; adhesive effects are not established here.
What to prepare
BLNKK suggests preparing wavelength, polarization, modes, geometry, offsets and measured loss. Check coordinates, sampling, convergence and whether to restore the substrate.
Confirm with the supplier
Confirm software versions, licensing and field exchange, then discuss substrate loss, tilt projection and calibration. Agree how external thermomechanical results would enter the optical model.
Public evidence: The official example documents offsets, ZBF exchange and convergence settings, rather than validation of a particular device.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.