Sherlock physics-of-failure life prediction
Estimates failure risk and relative life under thermal cycling, vibration and mechanical shock before committing to extensive physical builds.
Ansys, part of Synopsys
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Thermo-mechanical stress · electronics reliability · package simulation
Applications: Electronics assembly, modules and board-level reliability · HBM, chiplets and 2.5D/3D ICs · IC packages, PCBs, AI and power systems · RF packages / high-speed interconnects · Silicon photonics / CPO optical coupling · Packages, PCBs and return paths
Catalog solutions · 6
RedHawk-SC Electrothermal stress and warpage analysis for 3D-ICs
Power, cooling and material expansion interact in multi-die packages, requiring combined evaluation of temperature, thermal stress and warpage rather than die temperature alone.
Icepak–Mechanical coupled thermal-flow and stress analysis for electronics
Cooling conditions change package, board and system temperatures, affecting thermal expansion, displacement and stress.
HFSS 3D electromagnetic analysis of package transitions
Compare package-transition loss and crosstalk using geometry, materials and measurement ports together in a 3D EM model.
Lumerical–OpticStudio fiber-to-chip coupling workflow
Compare fiber-to-chip coupling loss against optical modes, microlens geometry and alignment errors.
SIwave package EMI and return-path analysis
Package/PCB return-path and coupling concerns need consistent geometry and excitation when comparing EMI paths.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- HFSS 3D electromagnetic analysis of package transitions · Temperature-dependent errors in chiplet die-to-die links →
- Icepak–Mechanical coupled thermal-flow and stress analysis for electronics · Thermal coupling and layer temperatures in HBM stacks →
- Sherlock physics-of-failure life prediction · Board-level BGA solder-joint fatigue under thermal cycling →
- Lumerical–OpticStudio fiber-to-chip coupling workflow · Optical alignment loss during CPO fiber attachment →
- Lumerical–OpticStudio fiber-to-chip coupling workflow · Temperature-dependent optical coupling drift in CPO →
- SIwave package EMI and return-path analysis · Package electromagnetic coupling and shielding window →
- HFSS 3D electromagnetic analysis of package transitions · RF package transitions and insertion loss →
- HFSS 3D electromagnetic analysis of package transitions · Interposer routing crosstalk and isolation →
- HFSS 3D electromagnetic analysis of package transitions · Interposer routing crosstalk and isolation →
Public sources
- Product information: Sherlock physics-of-failure life prediction
- Technical reference: Ansys Sherlock: Reliability Physics in Your Design Process (PDF)
- Technical reference: Sherlock Theory Reference (PDF)
- Product information: RedHawk-SC Electrothermal stress and warpage analysis for 3D-ICs
- Technical reference: Electrothermal signoff for 2.5D/3D ICs: 2021 webinar overview and request
- Public reference: resource-center/white-paper/3d-heterogenous-integration
- Product information: Icepak–Mechanical coupled thermal-flow and stress analysis for electronics
- Public reference: content/dam/product/electronics/icepak/tb-thermal-solutions-for-3d-ic-pkg-and-sys.pdf
- Technical reference: AEDT Mechanical–Structural power-resistor tutorial (2024 R2)
- Product information: HFSS 3D electromagnetic analysis of package transitions
- Product information: Lumerical–OpticStudio fiber-to-chip coupling workflow
- Product information: SIwave package EMI and return-path analysis
Contact information
Contact the supplier directly through its official channels.
Taiwan · Supplier office
Ansys Taiwan — Taipei
- Phone
- +886 2 8101 5558
Official source ↗Source checked
Taiwan · Supplier office
Ansys Taiwan — Hsinchu
- Phone
- +886 3 621 8539
Official source ↗Source checked
Taiwan · Supplier-listed distributor
CYBERNET SYSTEMS TAIWAN Co., Ltd.
- Phone
- +886 3 611 8668
Official source ↗Source checked
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