RedHawk-SC Electrothermal stress and warpage analysis for 3D-ICs
Ansys, part of Synopsys · Thermo-mechanical simulation and lifetime prediction
- Purpose
- Power, cooling and material expansion interact in multi-die packages, requiring combined evaluation of temperature, thermal stress and warpage rather than die temperature alone.
- Technical approach
- Coupled electrothermal and finite-element thermal-mechanical analysis connects power and temperature to structural response, including expansion-induced stress and warpage in multi-die packages and interconnects.
- Scope of use
- Supports design evaluation and thermal-mechanical signoff for HBM, chiplets and 2.5D/3D ICs. Define the analysis scope through the actual geometry, material models and software configuration.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsStress and warpage under operating temperatures do not establish complete manufacturing residual-stress or lifetime qualification. Confirm coverage of project-specific behavior such as cure shrinkage or viscoelasticity for the proposed models and tools.
What to prepareBring die/package geometry, interconnects, thermomechanical material properties, power scenarios and cooling boundaries. Include available temperature and warpage measurements for model correlation.
Confirm with the supplierConfirm solver, model-exchange and signoff capabilities for the proposed version and licenses, including what runs within RedHawk and what needs other tools. Ask how the actual package model will be calibrated and validated.
- Public evidence
- The official product page describes an integrated thermal-mechanical solver, temperature-dependent power and multi-die models. The official article distinguishes quick signoff from detailed analysis with Mechanical, LS-DYNA and Icepak.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.