Sherlock physics-of-failure life prediction
Ansys, part of Synopsys · Thermo-mechanical simulation and lifetime prediction
- Purpose
- Estimates failure risk and relative life under thermal cycling, vibration and mechanical shock before committing to extensive physical builds.
- Technical approach
- Converts ECAD, material and component data into FEA-ready models, applies physics-of-failure models to solder fatigue and board/component stress, and connects with Mechanical, Icepak or LS-DYNA when deeper analysis is needed.
- Scope of use
- Supports early reliability screening, design comparisons and test planning for PCBs, modules and electronic assemblies. Package-level coverage depends on component type, software release and the selected model.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsLife estimates apply to selected mechanisms and input assumptions; they do not cover every package failure or guarantee field life. Review incomplete material, thermal-profile or mounting data and plan physical validation.
What to preparePrepare ECAD, BOM, stackup, material data, mount points and operating/test loads, identifying gaps. Existing temperature or failure-test data can support calibration discussions.
Confirm with the supplierConfirm version-specific component and mechanism coverage, required inputs, solver and licensing configuration. Agree how predictions will be checked against tests and how uncertainty will be reported.
- Public evidence
- The official product page positions Sherlock as a physics-of-failure electronics reliability tool and lists thermal cycling, vibration, shock, solder-fatigue analysis, ECAD-to-FEA workflows, and component/material libraries.
Supporting references
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.