Spherolyte Ni copper-diffusion-barrier plating

MKS’ Atotech · Material properties and interface engineering

Purpose: Consider a nickel barrier when an interconnect investigation points to copper diffusion or metallization; establish the failure mechanism first.
Technical approach: An all-liquid electrolyte deposits nickel with application-specific additives. The iron additive supports NiFe plating, a different configuration.
Scope of use: For advanced-packaging metallization compatible with electroplated nickel. Contact metals, thickness and subsequent soldering need review.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Changing metallization does not repair an existing brittle joint. The page does not qualify a specific pad/solder combination or demonstrate elimination of fracture.
What to prepare
BLNKK suggests preparing pad/UBM stacks, solder, nickel thickness, thermal history, cross-sections and fracture evidence to compare joint behavior.
Confirm with the supplier
Confirm barrier-specific additives, bath control, equipment, pretreatment and deposit requirements. Review stack compatibility and the aging tests needed before adopting the change.
Public evidence: The official page names Cu diffusion barriers but provides no solder-IMC fracture or aging qualification for a particular stack.

Contact the supplier

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