Spherolyte Ni copper-diffusion-barrier plating
Consider a nickel barrier when an interconnect investigation points to copper diffusion or metallization; establish the failure mechanism first.
MKS’ Atotech
Explore the supplier’s public information and its documented technical solutions.
View contact information ↓Public capability summary
- Brittle solder-interface fracture needs metallization and aging comparisons, not only solder changes.
Other names: MKS’ Atotech · Atotech · MKS Atotech
Applications: Solder interconnects / UBM metallization · HDI and organic-board blind microvias · Wafer copper pillars · Cu / Al pad metal finishes
Catalog solutions · 4
InPro MVF blind-microvia copper filling
Evaluate blind-microvia copper filling for HDI and flexible PCBs while managing surface copper thickness.
Spherolyte Cu UF5 copper-pillar forming chemistry
Pillar height/top-profile assessment needs patterned-geometry and plating-condition comparisons.
Xenolyte ENEPIG contact-finish chemistry suite
Compare pad finishes when evaluating solder attachment and interfacial reactions.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- Evaluation of InPro SAP3 as a microvia copper-fill candidate · Internal voids in substrate microvia copper fill →
- InPro MVF blind-microvia copper filling · Internal voids in substrate microvia copper fill →
- Assessment of Spherolyte Cu TSV AF via filling · Seams and voids in TSV copper fill →
- Spherolyte Cu UF5 copper-pillar forming chemistry · Microbump height variation and coplanarity →
- Spherolyte Ni copper-diffusion-barrier plating · Brittle fracture at solder IMC interfaces →
- Xenolyte ENEPIG contact-finish chemistry suite · Brittle fracture at solder IMC interfaces →
Public sources
Contact information
Contact the supplier directly through its official channels.
These contacts and the form cover Atotech electronics plating and other surface treatment businesses. Specify advanced packaging, PCB or the product needed for routing. Taiwan and China share the Greater China mailbox; it is not a separate mailbox for each office. Official source ↗
United States · Headquarters
Atotech USA, LLC — Americas Headquarters
- Phone
- +1 803 8173500
Official source ↗Source checked
Taiwan · Supplier office · Sales inquiries
Atotech Taiwan Limited — Taipei Sales Office
- Atotech-GC@mks.com
- Phone
- +886 2 2717 6868
Official source ↗Source checked
Mainland China · Supplier office · Sales inquiries
Atotech (China) Chemicals Ltd. — Nanjing Sales Office
- Atotech-GC@mks.com
- Phone
- +86 25 84801788
Official source ↗Source checked
More regional contacts (1)
Germany · Headquarters
Atotech Deutschland GmbH & Co. KG — Global Headquarters
- info.atotech@mks.com
- Phone
- +49 30 349850
Official source ↗Source checked
Contacts are listed in the supplier’s public information. Confirm product responsibility and service coverage with the supplier.
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.