Xenolyte ENEPIG contact-finish chemistry suite

MKS’ Atotech · Process equipment and thermal control

Purpose: Compare pad finishes when evaluating solder attachment and interfacial reactions.
Technical approach: ENEPIG combines pretreatment, electroless nickel, electroless palladium and immersion gold; the primary page covers the nickel component.
Scope of use: Documented for Cu/Al pads before wire bonding or soldering; select each process for the intended application.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
A finish does not guarantee elimination of brittle IMC. Nickel grades and immersion versus autocatalytic thick-gold processes are not interchangeable.
What to prepare
BLNKK suggests preparing pad materials, target thicknesses, solder and reflow/aging histories, plus wetting, cross-section and fracture-location data.
Confirm with the supplier
Confirm compatible chemistries, pretreatment, thickness windows, equipment and sample-validation methods.
Public evidence: The Ni, Pd HS and Au pages describe their roles and distinguish ENEPIG, ENIG and ENEP.

Supporting references

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