InPro MVF blind-microvia copper filling

MKS’ Atotech · Process equipment and thermal control

Purpose: Evaluate blind-microvia copper filling for HDI and flexible PCBs while managing surface copper thickness.
Technical approach: InPro MVF uses DC plating, insoluble anodes, sparger agitation and external copper replenishment in vertical equipment.
Scope of use: Listed uses include HDI/flex PCBs, with or without conformal through-hole plating. IC substrates and particular via geometries require confirmation.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Family-level pulse plating and IC-substrate applications do not establish MVF suitability. Examples and reliability statements do not guarantee void-free filling or qualification for every geometry.
What to prepare
BLNKK suggests via dimensions, materials/seed layers, existing plating conditions, cross-section defects and surface-copper targets.
Confirm with the supplier
Confirm MVF/MVF2 selection, geometry-specific process windows, agitation/replenishment, acceptance criteria and reliability-test conditions.
Public evidence: The MVF/MVF2 page describes process configuration and filling examples; a separate portfolio explains the broader InPro family.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.