TGV glass-core and interposer substrates for advanced packaging

AGC · Package architecture and warpage compensation

Purpose: Offers glass-core or interposer options for chiplet, CPO and RF packages needing dimensional stability, thermal-expansion matching and vertical interconnects.
Technical approach: Combines composition-dependent glass properties with high stiffness and patterned through-glass vias or cavities.
Scope of use: For glass-core, interposer and 3D-integration development; confirm material, thickness, vias and panel configuration for the design.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Glass properties do not guarantee package warpage or reliability. Validate metallization, build-up integration and the complete stack; published examples do not cover every combination.
What to prepare
Prepare stack-up, copper and die layout, thermal history, warpage targets, via geometry, and electrical/mechanical requirements.
Confirm with the supplier
Confirm glass and tolerances, metallization scope, process compatibility, samples, qualification evidence and production supply.
Public evidence: AGC’s current TGV page documents custom vias and wafer/panel formats; CES material also describes CTE adjustment and a 510 × 515 mm panel example. Ranges from different pages do not establish a single deliverable configuration. Older presentations provide background rather than current specifications.

Supporting references

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