TGV glass-core and interposer substrates for advanced packaging
Offers glass-core or interposer options for chiplet, CPO and RF packages needing dimensional stability, thermal-expansion matching and vertical interconnects.
AGC
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- Glass substrates · low-loss materials · semiconductor process materials
Applications: Chiplet, CPO, RF and 3D integration · RF materials / substrate resin formulation · Mold release/seal contact comparison · RF board-transition/dielectric comparison
Catalog solutions · 4
RESIFA H-series low-dielectric silica fillers
Evaluate dielectric filler choices for RF formulations at the intended frequencies and processing conditions.
AGC Fluon ETFE semiconductor mold-release film
Molding review needs film/tool/resin contact comparisons to understand film placement and seal geometry.
AGC RF/digital copper-clad laminates
RF board-transition loss depends on dielectric properties, conductors and routing geometry, not the material designation alone.
Candidates in engineering problem guides
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
- TGV glass-core and interposer substrates for advanced packaging · Warpage reversal during cooling in large 2.5D FCBGA packages →
- RESIFA H-series low-dielectric silica fillers · RF package transitions and insertion loss →
- AGC RF/digital copper-clad laminates · RF package transitions and insertion loss →
- AGC Fluon ETFE semiconductor mold-release film · Mold flash and the tool-sealing process window →
Public sources
- Product information: TGV glass-core and interposer substrates for advanced packaging
- Technical reference: Glass benefits for semiconductor packaging (PDF)
- Technical reference: TGV wafer and panel roadmap (PDF)
- Product information: RESIFA H-series low-dielectric silica fillers
- Product information: AGC Fluon ETFE semiconductor mold-release film
- Product information: AGC RF/digital copper-clad laminates
Contact information
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.