RESIFA H-series low-dielectric silica fillers

AGC · Material properties and interface engineering

Purpose: Evaluate dielectric filler choices for RF formulations at the intended frequencies and processing conditions.
Technical approach: RESIFA H-series silica fillers are incorporated into resin formulations to influence composite dielectric constant and loss.
Scope of use: AGC lists copper-clad laminates, PCBs, films, potting and RF devices; resin compatibility and dispersion need review.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Filler properties do not establish cured-composite or finished-substrate performance, or guarantee insertion loss. Results depend on frequency, conditioning and specimen preparation.
What to prepare
BLNKK suggests preparing resin and filler proportions, dispersion method, target frequencies, Dk/Df measurement methods, and moisture and processing targets.
Confirm with the supplier
Confirm grades, particle size and surface treatment, formulation guidance, and dielectric and reliability data with stated test conditions.
Public evidence: The product page describes low-Dk/Df applications qualitatively without grade-specific values or measurement frequencies.

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