AGC RF/digital copper-clad laminates

AGC · Material properties and interface engineering

Purpose: RF board-transition loss depends on dielectric properties, conductors and routing geometry, not the material designation alone.
Technical approach: AGC copper-clad laminates, prepregs and bondplies form conductor/dielectric stacks, with thermoset and thermoplastic options.
Scope of use: For RF/microwave and digital board-material comparisons, with grade, thickness, copper and processing confirmed for the transition.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Family descriptions are not grade-specific loss or CAF qualifications. Materials cannot directly replace an interposer without interface and process validation.
What to prepare
BLNKK suggests gathering frequency range, stack/routing geometry, dielectric thickness, copper/roughness, process constraints and calibrated loss baselines.
Confirm with the supplier
Confirm current grade data, dielectric measurement conditions, copper/thickness options, processing recommendations, regional supply and test-board/transition evaluation.
Public evidence: The official page lists these material families and uses, rather than measured loss or reliability for this transition.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.