SST 5100 vacuum/pressure solder attachment

Palomar Technologies · Process equipment and thermal control

Purpose: Compare initial solder-attach voiding against metallization, solder and process history in a controlled vacuum/pressure environment.
Technical approach: Planar infrared heating runs programmable vacuum/gas-pressure profiles with logged thermal and pressure data. Confirm options such as formic-acid delivery.
Scope of use: Supplier-listed uses include fluxless eutectic attach and power modules, with suitable solderable surfaces and tooling.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Vacuum/pressure does not replace compatible solder and coatings. Verify voiding and reliability on samples; do not transfer settings to epoxy or DAF curing.
What to prepare
BLNKK suggests preparing metallization, solder, dimensions, tooling and profiles, with consistent void measurements and wetting/bond-quality comparisons.
Confirm with the supplier
Confirm installed atmosphere, pressure, heating/cooling and formic-acid options. Discuss coatings, tooling, trial conditions, void acceptance and subsequent reliability validation.
Public evidence: The product page describes the furnace; a separate plating article discusses solderability. Neither validates zero voiding in a user assembly.

Supporting references

Find the company’s contact details and ask about this solution through its official channels.