3880-II multi-process automated die bonder
Compare dispensing, placement and heating in initial die attach for mixed materials/components; voids and bondline thickness need sample validation.
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View contact information ↓Applications: Photonics, MEMS, power, RF and sensors · Solder / eutectic die attachment · Copper clips and power modules · Fine-wire ball / stitch interconnects
Compare dispensing, placement and heating in initial die attach for mixed materials/components; voids and bondline thickness need sample validation.
Compare initial solder-attach voiding against metallization, solder and process history in a controlled vacuum/pressure environment.
Copper-clip soldering needs controlled thermal/atmosphere conditions and records for comparison with joint quality.
For wirebond lift or heel-fracture evaluation, compare ball/stitch bonding conditions and loop formation.
These candidates are already documented in the engineering problem workflow. Review their conditions, sources and comparison details.
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