8100 thermosonic wire bonding
Palomar Technologies · Process equipment and thermal control
- Purpose
- For wirebond lift or heel-fracture evaluation, compare ball/stitch bonding conditions and loop formation.
- Technical approach
- 8100 provides automated thermosonic ball-and-stitch fine-wire bonding, customized loop profiles and ball bumping.
- Scope of use
- The page lists gold-wire and ball-bumping processes and SiP, MCM and COB applications. Validate the actual wire, pad and tool combination.
- Limitations and open questions
These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitationsFormation and monitoring features alone do not identify lift causes or prove fatigue life. Other bonders’ material/process capabilities cannot be assumed.
What to prepareBLNKK suggests preparing wire/pad surface details, capillary, recipe and loop geometry, with failure location, joint-strength and cycling results.
Confirm with the supplierConfirm wire/pad compatibility, tool and loop limitations, available process signals and the sample/reliability validation approach.
- Public evidence
- Palomar describes the named bonding method, looping, vision alignment and process-data monitoring on its 8100 page.
Contact the supplier
Find the company’s contact details and ask about this solution through its official channels.
Related engineering problems
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BLNKK organizes information from public sources. A company profile does not imply a documented solution. Applicability still needs confirmation against your samples and engineering conditions.