SST 8300 copper-clip vacuum pressure soldering

Palomar Technologies · Process equipment and thermal control

Purpose: Copper-clip soldering needs controlled thermal/atmosphere conditions and records for comparison with joint quality.
Technical approach: SST 8300 automates soldering under vacuum/gas pressure. RunAnalyzer reviews logged thermal and pressure profiles.
Scope of use: Copper clips and power-semiconductor assemblies are listed applications; suitability depends on solder, metallization, assembly and tooling.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Chamber gas pressure is not a mechanical pressure-sintering contact load, and does not guarantee void-free joints. Confirm formic-acid delivery, cooling and multi-chamber options for the installed configuration and materials.
What to prepare
BLNKK suggests preparing solder/metallization, clip geometry, tooling, flux/oxidation information and profiles, alongside X-ray, section or strength comparisons.
Confirm with the supplier
Confirm chamber/gas configuration, formic-acid compatibility, assembly-temperature measurement, profile export and acceptance methods; evaluate representative assemblies.
Public evidence: The product page documents copper clips, single/multi-chamber configurations and profile review. The gated brochure was not read.

Contact the supplier

Find the company’s contact details and ask about this solution through its official channels.