3880-II multi-process automated die bonder

Palomar Technologies · Process equipment and thermal control

Purpose: Compare dispensing, placement and heating in initial die attach for mixed materials/components; voids and bondline thickness need sample validation.
Technical approach: Automated handling combines vision, tool changing and dispensing with process-specific heat, force or UV options. Pulsed heat adds programmed profiles and feedback.
Scope of use: Listed uses include eutectic, epoxy, silver sinter, solder paste and thermocompression for photonics, MEMS, power and RF assembly.
Limitations and open questions: These evaluation considerations are compiled by BLNKK from public information. They are not supplier guarantees or a mandatory submission checklist.
Scope and limitations
Qualify each material/die/substrate process window. Heat, force and UV features depend on configuration and are not all standard.
What to prepare
BLNKK suggests preparing geometry, metallization, materials, dispensing and temperature/pressure histories, plus void, bondline and strength targets.
Confirm with the supplier
Confirm tooling/material compatibility, heat/force options, 3880-II pulsed-heat configuration and logging, then plan imaging and reliability trials.
Public evidence: The September 2021 release verifies launch; current pages describe processes/options, with heating-module compatibility requiring confirmation.

Supporting references

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